pk 504 (v1.1 ) march 19 , 201 2 www.xilinx.com 1 pk50 4 (v1.1 ) march 19 , 201 2 100% material declaration data sheet for spartan ? - 3e/ - 3a fgg484 (cu wire) package average weight: 2. 2 92 g component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total silicon die 0.043305 1.88 9 silicon 7440 - 21 - 3 100.00 0.043305 die attach material 0.007922 0. 34 6 silver 7440 - 22 - 4 77.50 0.006140 bismaleimide monomer trade secret 15.00 0.001188 acrylate monomer trade secret 7.50 0.000594 mold compound 0.811873 35. 421 solid epoxy resin trade secret 5.00 0.040594 phenol resin trade secret 3.00 0.024356 phenol novolac 9003 - 35 - 4 3.00 0.024356 metal hydroxide trade secret 3.00 0.024356 carbon black 1333 - 86 - 4 0.30 0.002436 silica fused 60676 - 86 - 0 70.40 0.571558 silicon dioxide 7631 - 86 - 9 15.00 0.121781 silica, crystalline 14808 - 60 - 7 0.30 0.002436 copper wire 0.005455 0.23 8 copper 7440 - 5 0 - 8 97.28 0.005307 palladium 7440 - 05 - 3 2.70 0.000147 impurities na 0.02 0.000001 solder balls 0.405411 17.6 87 tin (sn) 7440 - 31 - 5 95.50 0.387168 silver (ag) 7440 - 22 - 4 4.00 0.016216 copper (cu) 7440 - 50 - 8 0.50 0.002027 ? copyright 2011 - 2012 xilinx, inc. xilinx, the xilinx logo, virtex, spartan, ise, and other designated brands included herein are trademarks of xil inx in the united states and other countries. all other trademarks are the property of their respective owners
100% material declaration data sheet for spartan - 3e/ - 3a fgg484 (cu wire) package pk 504 (v1.1 ) march 19 , 201 2 www.xilinx.com 2 component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total substrate 1.0 18112 44. 419 copper (cu) 7440 - 50 - 8 27.90 0.28 4063 nickel (ni) 7440 - 02 - 0 5.55 0.056 523 gold (au) 7440 - 57 - 5 0.40 0.0040 55 glass fiber 65997 - 17 - 3 19.51 0. 198648 non halogen fire retardant na 0.01 0.000102 bt (core) 21645 - 51 - 2 105391 - 33 - 1 25722 - 66 - 1 9003 - 36 - 5 21645 - 51 - 2 40.09 0.4 08186 solder mask 14807 - 96 - 6 7727 - 43 - 7 7631 - 86 - 9 34590 - 94 - 8 85954 - 11 - 6 6.54 0.06 6535 revision history the following table shows the revision history for this document. notice of disclaimer xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or completeness, including, but not limited to, with respect to its compliance with applicable environmental laws and regulations. xilinx subcontracts the production, test and assembly of hardware devices to independent third - party vendors and materials suppliers (contractors). all data provided hereu nder is based on information received from contractors. xilinx has not independently verified the accuracy or completeness of this information which is provided solely for your reference in connection with the use of xilinx products . date version description of revisions 09/ 16 /11 1.0 initial xilinx release. 03/19/12 1.1 device family update.
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